國立高雄科技大學 機械工程系 (建工校區)

96

(技術移轉)

(其他)

Variation of Shear Strength of Lead Free Sn/3.0Ag/0.5Cu Solder Ball Joints

The 9th Electronics Packaging Technology Conference, (EPTC2007)

2007-12-10

2007-12-12

3

Other