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研討會論文
學年度2016
論文名稱(篇名)Bao-Hsin Liu, Yu-Liang Chen and Quang-Cherng Hsu, 2016 (Nov.), “Study on bonding and shear flow phenomena of shear probe test for BGA solder joint in nano-scale analysis,” ASME/IMECE 2016 (International Mechanical Engineering Congress & Exposition), Pheonix, Arizona, USA.
作者中文名許光城
作者英文名Quang-Cherng Hsu
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